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We are inviting you to partner with HÂþ»­â€™s Faculty of Engineering in supporting the 7^thÌýAnnual HÂþ»­ Engineering Capstone Conference (DECC) on Tuesday, April 11th, 2023.ÌýÌýThis year’s event will be held at Sexton Campus in the Emera Idea Building and the Richard Murray Design Building. Ìý

DECC is the largest and most engaging event for the senior year classes, incorporating all engineering disciplines. The students’ final design poster competition will showcase how the projects integrate course work and engineering design skills, providing innovative solutions for many local industrial partners.ÌýÌýIt is also an opportunity for companies like yours to demonstrate their commitment to engineering at HÂþ»­, experiential education, and innovation and economic development in our region.

Each year DECC attracts over 1,000 community and corporate stakeholders, including students, faculty, media, industry, our Nova Scotia engineering community and the public.ÌýÌýMore info can be found atÌýÌýÌý

We are inviting key companies and valued members of our community to sponsor this important event. All contributions will go towards DECC to ensure it is a quality event for our students and a great opportunity for students and industry to meet.

Sponsorship Levels

Titanium Title Sponsor: $7,500 sponsorship (1 only)

• Company name will be associated with the event
• Premier logo placement at the event, in event advertising and on event programme cover
• Premier logo placement at the event, in event programme and in digital media coverageÌý
• Invitation for company representative to give remarks during awards ceremony at the closing of the event
• Acknowledgement via social media, media release and press coverage

Diamond Design Sponsor: $3,000 sponsorship (8 available)

• Company name will be associated with a prize awarded to a top student team in a program, and the opportunity to present the award to the recipients
• Premier logo placement at the event, in event programme and in digital media coverage

Platinum Performance Sponsor: $1,000 sponsorship

• Logo placement at the event and in the event programme

Get Involved

All of the sponsorships are open for discussion, and a member of our team would be happy to discuss with you how we can customize the opportunity to maximize your conference experience. On behalf of the students and HÂþ»­ University Faculty of Engineering, we would like to thank you for considering this worthwhile opportunity.

Please contact one of our Engineers in Residence (listed below), or email capstone@dal.ca to confirm your sponsorship or to obtain more information about DECC. A member of our team will follow up with you to discuss sponsorship opportunities to see how we can work with you to engage in the 2023 HÂþ»­ Engineering Capstone Conference.Ìý

For more information contact :

• Kevin Bezanson - Civil and Resource Engineering
• Michael Petrosoniak - Process Engineering and Applied Science
• Sandra MacAulay ThompsonÌý- Industrial Engineering Ìýs.macaulay.thompson@dal.ca
• Corey Smith - Mechanical EngineeringÌýÌýcorey.s@dal.ca